Low cost modules for series production

The BLT-OEMMODLC-3 modules are specially designed to make the integration of Bluetooth into your projects easy and to keep the cost of mass production low.

• Low size
• Long Range Module
• Designed for high performance and throughput
• Configurable for short latencies and delays
• AT Command support
• Configuration via Bluetooth
• Qualified as Bluetooth product (Bluetooth version 2.0)
• Lead-free and RoHS compliant
• Connector for external antenna
• The module can be soldered directly to the host PCB
• Industrial and automotive temperature range -30...+85°C
• Individually tested and tuned during production
• Firmware available for special functions:
• Multipoint mit Wireless Multidrop™
• Repeater function
• Wireless I/O function

Bluetooth Support:
Bluetooth Version 2.0

Supported Bluetooth profiles:
Generic Access Profile (GAP)
Serial Port Profile (SPP)
Class I +17 dBm (>300 m)

Bluetooth chipset and stack:
Product is based on the well-known Philips BGB204 chipset and Philips host stack

Software:
All the software is included in the module
Can be configured locally or via Bluetooth using AT commands or the PC Wizard

Serial interface:
UART Logic-Level
Supported baud rates: 300 - 921.6k
Support for other baud rates
Flow control: CTS/RTS or none
RS422/485 support (external transceiver required)

Power Supply:
3.3 – 6.0 VDC

Power consumption:
Min: 10 mA
Average: 22 mA
Max: 170 mA (Peak)

Dimensions / Size (Typical):
16 x 36 x 3 mm

Environment:
Maximum operating temperature: -30...+85°C
Storage temperature: -40...85°C
Humidity RH 5-90% non-condensing